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MediaTek Helio vs MediaTek Dimensity: A Comparison

The introduction of affordable mobile chips from MediaTek, which began in 2003, enabled many smaller companies to enter the mobile phone market. The further arrival of better systems-on-a-chip has allowed new entrants to enter and compete in the particular smartphone and tablet segments with affordable Android devices. The fabless semiconductor company is still known for its budget and mid-range chips under the Helio brand but it has also since introduced better and flagship-level chips under the Dimensity brand to compete with Qualcomm Snapdragon. This article underscores the difference between MediaTek Helio and MediaTek Dimensity in terms of performance and positioning.

Sub-Brand Showdown: A Definitive Guide to the Difference Between MediaTek Helio and MediaTek Dimensity

Both Helio and Dimensity are systems-on-chip based on the ARM architecture. Helio was first introduced in 2015 with the release of Helio X10. The entire line was initially intended to target the mid-range and high-end smartphone market segments. It was a response to the growing demand for high-performing Android devices at more affordable price points. However, in its attempt to elevate its position in the high-performance and premium segment and accommodate the growing demand for 5G-enabled devices, MediaTek introduced the Dimensity line in 2019 starting with the Dimensity 1000. Dimensity has since become the main sub-brand for the high-performance and premium segment while Helio has been positioned for the budget and mid-range segment.

1. Specific Process Node

One of the main differences between MediaTek Helio and MediaTek Dimensity is the process node used. Helio chips tend to be based on older and larger process nodes while Dimensity chips use newer and smaller process nodes. For example, for chips launched in 2020, Helio G80 and P95 were based on a 12nm process node while Dimensity 1000 was based on a 7nm process node. Helio G100, which was launched in 2024, was based on a 6nm process node while Dimensity 9000, which was launched in 2023, was based on a 4nm process node.

Take note that chips under both sub-brands are designed by MediaTek using ARM architecture and are manufactured by Taiwan Semiconductor Manufacturing Company. The different process nodes used in producing Helio and Dimensity chips translate to differences in performance and price. Dimensity chips have better performance, lower power consumption, more advanced components, and higher manufacturing costs and market prices than Helio chips by default because they are designed and produced using the most latest process nodes.

2. CPU and GPU Architectures

Helio generally uses older and less powerful ARM instruction set architecture, ARM Cortex CPU microarchitecture, and ARM Mali GPU microarchitecture. Consider Helio G100 as an example. This chip was released in 2024.  It is based on ARMv8.2A instruction set architecture. It also has an 8-core CPU configuration with 2 high-performance cores based on ARM Cortex A76 and 6 power-efficiency cores based on ARM Cortex A55. The GPU is based on the mid-range ARM Mali-G57 MC2 which was launched in mid-2021.

Dimensity uses newer and more powerful ones. Dimensity 9300, which was launched in 2023, is based on ARMv9.2-A. It has an 8-core CPU configuration that includes 1 overclocked ARM Cortex-X4 core for higher-performance general processing, 3 normally-clocked performance cores based on ARM Cortex-X4, and 4 power-efficient ARM Cortex A720 cores. The GPU is based on ARM Immortalis-G720 which was first launched in 2023 and positioned as a flagship integrated graphics processor for high-end mobile devices.

3. General and Graphics Performance

The aforementioned difference between MediaTek Helio and Media Dimensity further translates to differences in terms of general or overall performance and specific graphics performance. Chips under the Dimensity sub-brand are inherently better. For example, considering Dimensity 9300, it scored 2,014,182 in AnTuTu while Helio G100 scored 406,479 under the same benchmark test. This is a 396 percent difference in terms of overall performance. Note that Helio G100 is closer to the older Dimensity 1000 and Snapdragon 780 5G.

Furthermore, in terms of graphics performance, Dimensity chips have better integrated GPUs. The Dimensity 9300 has 10 execution units, 192 shading units, and around 5900 giga floating point operations per second. Helio G100 has 2 execution units, 32 shading units, and around 243 giga floating point operations per second. The difference between Helio and Dimensity chips launched during a particular production cycle is wide because the latter is based on more recent architectures and equipped with the latest processor technologies.

4. Other Technical Specifications

Both sub-brands of MediaTek chips also have different components. Helio chips tend to have more basic or less advanced hardware components. They support the older cellular technology like 4G LTE. These chips also feature older generations of Bluetooth and Wi-Fi modems. They also have limited maximum memory support using an older LPDDR generation and a limited system cache memory. Furthermore, when it comes to co-processors, these chips use less advanced artificial intelligence accelerator and image signal processor.

Newer models of Dimensity chips will always support the latest cellular technology. Remember that MediaTek launched this sub-brand to cater to the growing demand for 5G-enabled devices. These chips also support the latest Bluetooth and Wi-Fi modems available. They also have a higher maximum memory support using the latest LPDDR generation and a higher cache memory. The use of more advanced artificial intelligence accelerator is another selling point. These chips intend to respond to the growing applications of AI in smartphones.

5. Branding, Positioning, and Marketing

Remember that the main difference between MediaTek Helio and MediaTek Dimensity centers on their respective branding and positioning. Helio chips cater to the budget and mid-range segments of the smartphone and tablet markets. Their specifications are either older or less advanced because affordability is their main selling point. Dimensity chips are intended for the high-performance and premium market segments. They compete against flagship systems-on-chip from Qualcomm like the Snapdragon 8 series and Samsung Exynos.

The availability of Helio chips has enabled smaller and newer manufacturers to enter and compete in the smartphone and tablet markets. There are also a range of product categories under the Helio sub-brands. The Helio G series is intended for the mid-range gaming segment while the Helio P series is intended for the general mid-range segment. Helio A is older but is still used for the budget market segment. Dimensity is intended for the high-end performance segment but older models have been used for the premium mid-range segment.